30W powerful power: equipped with 30 watts of ultra-high cooling power, which is several times that of ordinary radiators! Quickly dissipate the high temperature caused by the heat dissipation components, plug and play, cool down in seconds, and escort high-performance games.
Ultra-large heat dissipation area: using professional-grade 50x50mm large-area TEC semiconductor cooling chip, with a heat dissipation surface of up to 4185mm², to create a notebook-level heat dissipation experience, full-dimensional coverage of the heating area.
Hollow magnetic fit design: using a hollow magnetic structure, perfectly fit the back panel of the mobile phone, no need for adhesive stickers, no camera cover, the heat source directly contacts the cold surface, the heat has nowhere to escape, and is suitable for most tablet mobile phone models.
Designed for high-performance tablet mobile phones: customized and optimized for large-size devices, whether you are a ROG gaming phone, iPhone Pro Max or a tablet device, you can enjoy an extremely fast cooling experience.
Material: ABS